Broadwell CPU Delay and iPad Competition May Reduce 2014 Notebook Shipments
Industry-wide notebook shipments will continue to decline in 2014, claims NPD DisplaySearch. Revised estimates predict shipments from all vendors, including Apple, will reach 134 million units, down from an earlier estimate of 152 million unit.

One factor contributing to this decline is the expected Q3 2014 launch of Intel's upcoming Broadwell CPU. Intel confirmed in its latest earnings conference call that its Broadwell chipset will enter production in Q1 2014 and become available in the second half of 2014. Slowing PC demand and yield issues forced Intel to delay Broadwell by at least a quarter from its original timetable, with that delay likely contributing further weakness in the PC market. Intel's Haswell processor line, the company's current CPU family and predecessor to Broadwell, was released in June 2013 and landed in the MacBook Air during the same month.
DisplaySearch also cites the rumored 12.9-inch iPad, wearables and the convergence of mobile and desktop operating systems as market forces that could shift consumers away from notebook PCs.
At the same time, the expected launch of a 12.9” iPad from Apple could trigger growth in larger tablet PC screen sizes, leading to even more competition for potential notebook PC buyers. In addition, wearable devices and other new concepts are expected to compete for consumer spending during the holiday season and beyond. Finally, the trend toward user-interface fusion and operating-system integration will offer a more seamless working platform between mobile devices and PCs, which would further extend mobile device advantages for businesses.
Despite a declining market, Mac sales in the just-ending quarter were strong, increasing from 4.06 million units in Q1 2013 to 4.8 million in Q1 2014. Mac net sales accounted for 11% of the company's revenue for the quarter, up slightly from 10% a year ago.
Popular Stories
Bloomberg's Mark Gurman has high expectations for Apple's first foldable iPhone.
In his Power On newsletter today, he said the foldable iPhone will be "the most significant overhaul in the iPhone's history."
"iPhone 4, iPhone 6 and iPhone X were clearly a big deal, but this is a whole new design," he said.
Like Samsung's Galaxy Z Fold 7, the foldable iPhone will reportedly open up like ...
iOS 26.5 is now available for developers, and while it doesn't include any new Siri capabilities, there are some major changes for the European Union, and smaller tweaks for features available worldwide.
Suggested Places
In the Maps app, there's a new "Suggested Places" feature that recommends locations to visit based on trending places nearby and recent searches. When Apple launches ads in ...
Apple has been celebrating its upcoming 50th anniversary by hosting surprise performances and other events around the world over the past few weeks, and now Bloomberg's Mark Gurman has revealed details about the company's grand finale.
In a social media post, Gurman said Apple's celebrations will conclude this week with a finale at its Apple Park headquarters for employees.
A special...
Popular Stories
Apple will update the MacBook Air with an OLED display for its 2028 model, according to Bloomberg's Mark Gurman.
Writing in his latest "Power On" newsletter, Gurman says that he expects the MacBook Air's transition from LCD to OLED to occur with the product's 2028 update, as part of a larger migration to OLED across the company's flagship iPad and MacBook models that includes the iPad mini,...
Apple on Monday unveiled the iPhone 17e and an updated iPad Air, but it is not finished yet. Apple promised "a big week ahead," and it is expected to announce additional new products this Tuesday, March 3 and Wednesday, March 4.
The most likely possibilities for Tuesday include updated 13-inch and 15-inch MacBook Air models with the M5 chip, and higher-end 14-inch and 16-inch MacBook Pro...
Apple today announced new 14-inch and 16-inch MacBook Pro models featuring M5 Pro and M5 Max chips, both built on a new Fusion Architecture that bonds two third-generation 3nm dies into a single chip using advanced packaging.
The Fusion Architecture is a first for Apple silicon, since previous chips used a single-die design. The two bonded dies house the CPU, GPU, Media Engine, Neural...